
Wafer Cutting & Dicing
Cutting layout, kerf, edge chipping, thickness and post-cut cleaning should be addressed during quotation.
CAPABILITIES
Our technical inquiry process helps organize requirements for wafer preparation, optical and ceramic components, and inspection.

SPECIFICATION REVIEW
Material selection is only one part of a precision component request. Manufacturing routes and acceptance limits depend on geometry, material hardness, surface condition and the intended process environment.
WEGITEK welcomes inquiry requests for cutting, grinding, polishing, drilling, machining, coating and inspection. These are subjects for feasibility review, not an unqualified statement that we own every process or machine.

TECHNICAL TOPICS

Cutting layout, kerf, edge chipping, thickness and post-cut cleaning should be addressed during quotation.

Surface roughness, total thickness variation, flatness and subsurface damage affect downstream processing.

Hole diameter, taper, position tolerance and edge damage should be controlled by an approved drawing.

Clear aperture, scratch/dig, flatness, AR/AF coating and inspection wavelength depend on the optical application.

Material grade, density, small features, chamfers and post-process cleaning influence feasibility.

Specify which parameters require a report, applicable methods and customer acceptance limits.

PROPOSAL PREPARATION
For wafers: material, polytype, orientation, diameter, thickness, dopant/resistivity, SSP/DSP, quality grade, TTV, bow/warp and quantity. For windows or ceramics: material grade, drawing revision, dimensions, edge details, finish and operating conditions.
Supply feasibility, dimensional tolerances, test reports, price, lead time and packaging will be confirmed in writing before the purchase is accepted.
Upload a Drawing →LET'S DISCUSS YOUR REQUIREMENTS
Share your target material, geometry, quantity and drawing to start a technical conversation.