PRODUCTS & MATERIALS
SOI Wafers
SOI Wafers: SOI wafers contain a device silicon layer separated from the handle wafer by buried oxide. Request device-layer thickness, BOX thickness, handle specification and bonding process acceptance criteria. For procurement, describe Material and orientation, diameter, base wafer, doping/resistivity, film type and thickness, polished faces, flat/notch and inspection level. We discuss product options and inspection requirements case by case, rather than publishing unsupported stock or tolerance guarantees.
SOI Wafers: SOI wafers contain a device silicon layer separated from the handle wafer by buried oxide. Request device-layer thickness, BOX thickness, handle specification and bonding process acceptance criteria. For procurement, describe Material and orientation, diameter, base wafer, doping/resistivity, film type and thickness, polished faces, flat/notch and inspection level. We discuss product options and inspection requirements case by case, rather than publishing unsupported stock or tolerance guarantees.
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